Student Conference on Engineering Sciences and Technology 2014
13th September 2014,
ISRA University, Hyderabad
Rastek Technologies has always remained forefront in promoting technical and scientific excellence in the field of Engineering Sciences and Technology and its participation has been acknowledged all over Pakistan by renowned universities and industries. In line of our vision to promote scientific research, technological innovation and to inculcate the educational institutes with the exposure of quality engineering knowledge and developments, Rastek Technologies became the Prime Sponsor to the biggest Student Engineering Conference that is conducted in Pakistan on yearly basis, namely IEEE SCONEST Conference.
This Years’ IEEE (Institute of Electrical and Electronic Engineers) SCONEST was held at ISRA University Hyderabad on 13th September 2014, in which Rastek Technologies was one of the prime Sponsor of the Event. The Conference organized jointly by IEEE ISRA University Hyderabad Branch, IEE Karachi Section, ISRA University Hyderabad Sindh was a one day conference which brought about many new engineering sciences students and professionals to present their research ideas, projects and theories on a vast number of topics. The conference included research papers from Electronic Engineering, Control Systems, Artificial Intelligence, Computer Society and Software Engineering Domains from almost 50+ engineering universities of Pakistan. The qualities of the papers were not only acknowledged by HEC (Higher Education Commission) of Pakistan but also by IEEE Review committee who greatly applaud the quality of research activities going on in Pakistan and an ISBN number was also issued to the conference sessions.
Chief Executive Officer of Rastek Technologies, Mr. Rafiq Ahmed Lakhani collected the prime sponsor shield from Isra University’s Conference Convener, Pro-Vice chancellor of the Isra University, Prof. Dr. Hameed ullah Qazi.
Rastek Technologies is glad to be associated with the IEEE Events in Pakistan and will continue to support future engineering projects and research ideas.